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News
[News] Intel’s Advanced Packaging, Led by EMIB-T, Set to Hit Its Stride in 2029; DRAM Manufacturing Ruled Out
2+ week, 13+ hour ago (258+ words) Memory was another key topic at the conference, as AI reshapes the strategic importance of memory. Tom’s Hardware previously reported that Intel CEO Lip-Bu Tan had hinted at a potential return to the memory market. Zinsner, however, clarified that Intel…...
[News] Powertech Bets NT$70B on World’s First Panel-Level AI Chip Packaging in 2027, Potentially Ahead of TSMC
2+ week, 13+ hour ago (477+ words) [News] Powertech Plans NT$70B Push for World’s First Panel-Level AI Chip Packaging in 2027, Potentially Ahead of TSMC TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Powertech Bets…...
[News] Samsung’s 4nm GAIA Could Mark First PIM Commercialization in AI PCs, Mass Production as Early as 2027
2+ week, 5+ day ago (450+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Samsung’s 4nm GAIA Could Mark First PIM Commercialization in AI PCs, Mass Production as Early as 2027 Samsung is exploring a…...
[News] Intel Unveils Three AI Architectures at Hot Chips 2026, Diamond Rapids Taps In-House 18A-P and Packaging
2+ week, 6+ day ago (451+ words) [News] Intel Unveils Three AI Architectures at Hot Chips 2026, Diamond Rapids Taps In-House 18A-P and Advanced Packaging TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Intel Unveils…...
[News] Hot Chips 2026: Samsung’s zHBM Claims 70% Power-Efficiency Gain; SK hynix Evaluates Intel EMIB
3+ week, 11+ hour ago (675+ words) South Korean memory giants Samsung and SK hynix took different routes at Hot Chips 2026 in showcasing their HBM roadmaps. According to Wccftech and ServerTheHome, Samsung laid out a three-step evolution from standard HBM to custom HBM and ultimately zHBM, claiming…...
[News] Intel May Tap TSMC N2X for Some Razor Lake Chips in 2027, Depending on 18A-P Performance
3+ week, 4+ day ago (490+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Intel May Tap TSMC N2X for Some Razor Lake Chips in 2027, Depending on 18A-P Performance Competition between Intel and TSMC…...
[News] Marvell, AMD Reportedly Shake Up Google TPU Race, Putting Broadcom, MediaTek Under Pressure
3+ week, 4+ day ago (275+ words) The battle for custom AI chips is heating up, with two heavyweight chipmakers—Marvell and AMD—potentially joining the race for Google’s next-generation Tensor Processing Units (TPUs). AMD could also be entering the fray. As eported by Tom’s Hardware, citing…...
[News] Japan’s Socionext Adds Intel’s 18A-P to Foundry Mix Alongside TSMC
3+ week, 4+ day ago (295+ words) Shortly after announcing in June the risk production of 18A-P, the first performance-enhanced node in its Intel 18A family, Intel has landed a new external customer. According to a press release, Japanese SoC designer Socionext said it will use 18A-P to…...
[News] MLCC Lead Times Diverge as High-End Products Stretch to 5–10 Months; Tightness May Extend Into 2027
3+ week, 6+ day ago (483+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] MLCC Lead Times Diverge as High-End Products Stretch to 5–10 Months; Tightness May Extend Into 2027 AI-driven demand is tightening the…...